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Supercharging Europe's connectivity
15 - 17 October, Intercontinental at the O2, London
Today's Top Story
Today's Top Story
Arm Holdings has reportedly cancelled Qualcomm’s licence to develop hardware based on its architecture.
Intelsat’s IS-33e satellite has broken into pieces causing outages for customers in Europe, Africa and parts of Asia Pacific.
Hemlock Semiconductor (HSC) has secured $325 million in direct funding from the US government to construct a new manufacturing facility at its campus in Hemlock, Michigan.
GlobalNet has launched a new 1,200km subset route connecting Stockholm and Berlin to expand its European network infrastructure.
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Latest News
Latest News
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Bertold Frech explains how the evolving digital landscape requires mindsets to evolve
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The winners of the 20th annual Global Connectivity Awards (GCAs) were revealed at a glitzy show in London following Capacity Europe 2024, with stc, Mobily, and Sparkle among those taking home awards.
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Semiconductor manufacturer Wolfspeed is the latest chipmaker to receive funding under the US CHIPS and Science Act, receiving up to $750 million to build a new silicon carbide wafer manufacturing site in North Carolina.
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Forthcoming Events
In-depth (features and interviews)
In-depth (features and interviews)
In an exclusive interview with Mr Philip Liu, president of the MEA consumer business unit, we explore ZTE’s market strategies, deployment plans, and upcoming innovations.
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